Caracterização da liga AI-7%-Si-1%Cu produzida por solidificação unidirecional

Abstract

There are several properties of aluminum alloy that arouse great industrial interest: low density, high thermal and electrical conductivity, good workability in machining processes and metal forming and highly corrosion resistant. Currently, these alloys are produced in a wide variety of compositions and systems. The literature presents several both theoretical and experimental studies focusing on the microstructural evolution of binary aluminum-based alloys. However, few studies addressing important families of multicomponent aluminum-based alloys. In this sense, the present study aimed to analyze a ternary alloy Aluminum Silicon Copper (Al 7% Si 1% Cu) with respect to the microstructural evolution, and behavior of thermal parameters during directional solidification. For the production of aluminum and silicon ternary alloys and commercially pure electrolytic copper are used. The League was solidified unidirectionally and the behavior of the velocity of the liquidus isotherm were investigated, the cooling rate and thermal gradient during solidification. analyzed parameters showed good agreement with the proposed, especially the speed of the liquidus isotherm and the cooling rate analytical model.